Zhuhai Cersol Technology Co, Ltd

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Electronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal Conductivity

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Zhuhai Cersol Technology Co, Ltd
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City:zhuhai
Province/State:guangdong
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Electronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal Conductivity

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Brand Name :Cersol
Place of Origin :China
Payment Terms :T/T IN ADVANCE
Packaging Details :BAGS, BARRELS, CARTONS
Materilals :Aluminum Nitride
Color :Grey and White
Size :Customize
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Specification

Specification of Aluminum Nitride Substrates
Description Aluminum nitride ceramic substrate has excellent thermal conductivity, lower dielectric constant and medium loss, reliable insulation performance, excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion. It is widely used in different areas such as communication devices, high brightness LEDs, and electronic electronic devices. It is an electronic ceramic material with excellent performance.
Advantages (1) It has a high thermal conductivity(>200w), which is 5-10 times than that of alumina ceramics.
(2) The thermal expansion coefficient (4.3x10-6/℃) matches semiconductor silicon material (3.5-4.0x10-6/℃).
(3) Good mechanical properties, bending strength higher than BEO ceramics, close to alumina.
(4) Excellent electrical performance, high insulation resistance and low medium loss.
(5) The circuit material is compatible with good compatibility, and multi-layer wiring can be performed to achieve the high density and miniaturization of the packaging.
(6) Non-toxic, which is conducive to environmental protection.
Materials Properties C-ALN-200
Color Grey and White
Density g/cm3 ≥3.0
Surface Roughness Ra μm 0.300-0.600
Flexural Strength MPa >320
Camber Length‰ ≤2
Thermal Conductivity 25℃, W/(m·k) ≥200
Coefficient of Thermal Expansion 10-6/K(40-400℃) 4.0-5.0
10-6/K(40-800℃) 3.5x10-6
Dielectric Constant kv/MN 17
Volume Resistance 25℃,Ω·cm ≥1014
Remarks: Above values are typical and not for specification.
Size Thickness Length*Width
0.381mm 50.8*50.8mm
110*110mm
114.3*114.3mm
120*120mm
127*127mm
139*190mm
0.500mm
0.635mm
1.0mm
1.5mm
Applications LED package Electronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal Conductivity
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Ultra-power laser semiconductor LD Electronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal Conductivity

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Electronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal ConductivityElectronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal ConductivityElectronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal ConductivityElectronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal ConductivityElectronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal ConductivityElectronic Ceramic Material Grey Alumunim Nitride Substrates for LED package with 200W/(m·k) Thermal Conductivity

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